0,15 MM EMMC EMCP UFS Reballing jig Platforma BGA153 BGA162 BGA169 BGA254 BGA221 BGA186 Reballing Stencil Planta Tablă de Oțel Net
48.69lei
77.29lei
-37 %
Nou
In stoc
ATENTIE: Ultimele bucati in stoc!
Data disponibilitate:
0,15 MM EMMC EMCP UFS Reballing jig Platforma BGA153 BGA162 BGA169 BGA254 BGA221 BGA186 Reballing Stencil Planta Tablă de Oțel Net
Etichete: emmc, bucurie con metal, kit de lipire, bga stencil, emmc ic reballing, laptop stencil, bga emmc stencil, bga153 stencil, bga rebal, cilindru kyocera m3040
Application1 | Telefon mobil EMMC EMCP BGA reparații |
Nume De Brand | TOOKKS |
Pachet | geanta |
DIY Consumabile | ELECTRICE |
Application2 | Computer repair kit |
Tip | EMMC/EMCP/UFS Reballing jig platforma |
Cerere | Computer Tool Kit |
Model | |
Origine | NC(de Origine) |
Numărul De Model | EMMC EMCP UFS Universale de Lipit jig Platforma |
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